IC Tester PCB

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World Class Top Company ISU PETASYS

Overview

IC Tester PCB for inspection of semiconductors

IC Tester checks whether semiconductor chips can correctly carry out their functions in the wafer & package condition during semiconductor process and determines the presence of any defects. It plays the role of minimizing losses due to defects by early evaluation on the function and reliability of semiconductor. To secure the driving force for the new growth based on ultra-multilayer technology competence, ISU PETASYS has entered IC Tester PCB market and concentrated on continuous product development. The technology and experience accumulated in new domain through challenge will be reflected on the existing network business to expect the creation of a synergy.

Product

Probe Card connects semiconductor chips with test equipment. The probe pin mounted on the Probe Card contacts on a wafer to be used for sorting defective semiconductor chips.

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Layer Structure

Specification
Item Specification
Thickness 6.2mm
PCB Size 480×480mm
DHS(Min) Φ0.2
Layer Count 82L
Surface Finish ENIG

It is one of the boards included in semiconductor test equipment together with the Probe Card. It is used for the purpose of an interface between tester and semiconductor.

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Layer Structure

Specification
Item Specification
Thickness 5.0mm
PCB Size 403x403mm
DHS(Min) Φ0.125
Layer Count 52L
Surface Finish ENIG

It is a board for the purpose of an interface used for Burn-In Test, which performs the role of transmitting various signals transmitted from the burn-in system to semiconductors. It is used for sorting early defects by giving bad conditions such as high temperature or high pressure to implement a resistance test and for evaluating product characteristics.

Product Image

Layer Structure

Specification
Item Specification
Thickness 1.6mm
PCB Size 450×571mm
DHS(Min) Φ0.35
Layer Count 8L
Surface Finish Hard Gold + ENIG
Special Polyimide Material