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PCB for AI Accelerators

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World Class Top Company ISU PETASYS

Overview

PCBs for AI Accelerators Equipped with AI Engines

AI accelerators are specialized processors designed to handle large-scale AI computations—such as matrix operations and deep learning—more quickly and efficiently than CPUs and GPUs. They are a core component of AI servers, improving AI training and inference performance as well as overall power efficiency.Leveraging its advanced high‑layer PCB technology, ISU Petasys has entered the AI accelerator PCB market to secure new growth drivers and is continuing to focus on technological innovation and product development. The technology and expertise accumulated through this new business are expected to create synergies when applied to our existing networking business.

Product

OAM Module

Probe Card connects semiconductor chips with test equipment. The probe pin mounted on the Probe Card contacts on a wafer to be used for sorting defective semiconductor chips.

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Layer Structure

Specification

Item	Specification
Thickness	2.5mm
PCB Size	480×480mm
DHS(Min)	Φ0.2
Layer Count	18L
Surface Finish	ENIG + HARD GOLD

It is one of the boards included in semiconductor test equipment together with the Probe Card. It is used for the purpose of an interface between tester and semiconductor.

Product Image

Layer Structure

Specification

Item	Specification
Thickness	5.0mm
PCB Size	403x403mm
DHS(Min)	Φ0.125
Layer Count	52L
Surface Finish	ENIG

It is a board for the purpose of an interface used for Burn-In Test, which performs the role of transmitting various signals transmitted from the burn-in system to semiconductors. It is used for sorting early defects by giving bad conditions such as high temperature or high pressure to implement a resistance test and for evaluating product characteristics.