|
|
|
|
|
| Item |
2002 |
2003 |
2004 |
 |
| Minimum
Line Width / Space |
3Mil / 3Mil |
3Mil / 3Mil |
2Mil / 2Mil |
|
| Smallest
Through Via Hole Size |
8Mil |
6Mil |
6Mil |
|
Smallest
Laser Micro
Via Hole Size
|
3Mil |
2Mil |
2Mil |
|
| Impedance-Single
Ended & Differential |
+/- 8% |
+/-7% |
+/-5% |
|
| Maximum
Layer Count |
30 + |
40 + |
50 + |
|
| Finished
Board Thickness |
0.014 " to 0.170 " |
0.014 " to 0.170
" |
0.010" to 0.200 " |
|
Maximum
Panel Size
|
20 " X 24 " |
20 "X 24 " |
20 "X 24 " |
|
Minimum
Dielectric Thickness
|
2 Mil |
1.6 Mil |
1.6 Mil |
|
| Surface
Treatment |
OSP, HASL, ENIG,
Electrolytic
Au,Immersion Ag,
Tin
|
Previous Plus
Other
Alternatives |
Previous Plus
Other
Alternatives
|
|
Aspect
Ratio
|
10
(with Pulse Plating)
|
12 |
14 |
|
Conventional
Blind &
Buried Via Holes |
Yes |
Yes |
Yes |
|
| Micro Via
Holes & Build-Up Technology |
Yes |
Yes |
Yes |
|
| Material
Types |
Tg = 140,170,190C
Epoxy, BT,
Cyanate Ester, Low
Dk,Df
|
Polyimide
|
Polyimide |
|
|
|
|
|
|
