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Improved Signal Integrity and "Noise" reduction
using "Via in Pad," Thermount, Mixed
Dielectrics and Various other techniques
0.5mm pitch BGA capability
Variations of Micro Via Structures
(cf. Micro Via Presentation)
Lead Free Replacements
Halogen Free Laminates
Embedded Passive
(Buried Capacitors, Buried Resistors)
3 mil line width & space for Outer Layer Circuitry
10MHz Ceramic Teflon Boards for RF
Hybrid PCB
Optical PCB
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