随着对高频网络板、通信设备和高速数据处理用超级计算机的需求增加，ISU PETASYS正在开发具备优异的电气特性，且可对应 Lead-free 的 High Performance资材与具备同等特性的 Lower Cost 资材。
Signal Integrity是电信号质量的衡量标准。是指当发信部位产生的信号通过信道传输时，接收部位测量的信号模式保留原始数字模式而不失真
Measurement Method : VNA, SPP, Delta-L, SET2DIL, SPDR
Simulation Tool : HFSS
为了提高Signal Integrity的性能，公司通过多种核心技术研究，研究提高PCB性能的方案。
随着电子工业的数据传输速度的增加，PCB高频信号特性变得越来越重要。
ISUPETASYS开发各种Signal Integrity、 Impedance Analysis及Control技术，生产高质量的产品。
- Variety of via construction by the Laser & mechanical Drill ( variety Via structure Makes the PCB substrate high density )
- Optimizing the PCB design and the layer count, when the Skip via and Stacked via is applied.
- Improving the Signal Integrity
| Item | Specification |
|---|---|
| SVH (Skip Via Hole) | 1~4L |
| BGA pitch | 0.5mm |
| Trace and Space | 3.0mil |
| MVH Aspect Ratio | 1:1 |
| Surface Treatment | Selective OSP, Immersion silver |
- Material : Ultra Low Loss and STD Loss (Hybrid)
- Layer : 3 + 8 + 8 + 8 + 3
- Thickness : 180mil
- Min. Line/Space : 4.0mil / 4.0mil
- SVH / Depth / Aspect Ratio 12mil / 11.4mil / 0.95 : 1
- Multiple Depth Drill in SCV & PTH
- Material : STD Loss
- Layer : 1 + 8 + 4+ 8 + 1
- 2Stacked Via
- Thickness : 119mil
- Min. Line/Space : 3.5mil / 4.0mil
- MVH / Depth / Annular Ring-5mil / 4.2mil / 12mil
- Material : Low Loss and BC Material
- Layer : 16 layers
- Thickness : 114mil
- Min. Line/Space : 3.8mil / 4.0mil
- MVH / Depth (Aspect Ratio)-10mil / 7.5mil / (0.75:1)
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